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Manho L Electrical Design Of Through Silicon Via 2014 |
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Torrent Details |
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Description |
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Textbook in PDF format
Provides fundamental modeling of TSV which is a very essential part of 3D ICs. Includes both numerical formula analysis and qualitative explanations. Approach from various view points: signal integrity, power integrity and etc. Has appeal for academia and industry.
Includes supplementary material: sn.pub/extras
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Files in this torrent |
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| FILENAME | SIZE | |
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![]() | Manho L. Electrical Design of Through Silicon Via 2014.pdf | 12.4 MB |
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